High Density Interconnect Printed Circuit Board With FR4 TG150 BGA For

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GT SMART (Changsha) Technology Co., Limited

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City: Shenzhen

Province/State: Guangdong

Country/Region: China

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High Density Interconnect Printed Circuit Board With FR4 TG150 BGA For

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High Density Interconnect Printed Circuit Board With FR4 TG150 BGA For

Product Description: The HDI PCB (High Density Interconnect Printed Circuit Board) is a cutting-edge technology that offers exceptional performance and reliability for a wide range of electronics ...

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